Influence of Epoxy/Nanosilica on Mechanical Performance of Hemp/Kevlar Fiber Reinforced Hybrid Composite with an Ultrasonic Frequency

Velmurugan, G. and Natrayan, L. and Rao, Yenda Srinivasa and Gaur, Piyush and Sekar, S. and Chebolu, Rohinikumar and Patil, Pravin P. and Paramasivam, Prabhu and Modigunta, Jeevan Kumar Reddy (2022) Influence of Epoxy/Nanosilica on Mechanical Performance of Hemp/Kevlar Fiber Reinforced Hybrid Composite with an Ultrasonic Frequency. Adsorption Science & Technology, 2022. pp. 1-11. ISSN 0263-6174

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Abstract

Ultrasonic vibration was employed in blending the nanosilica into epoxy resin to manufacture hemp/kevlar/nanosilica-based epoxy composites, with an ultrasonic occurrence of 20 kHz and a 900 W capacity of power. An ultrasonic probe was utilized to ensure the consistent dispersion of the nanoparticles in the epoxy. The mechanical characteristics of hemp/kevlar fiber reinforced with epoxy/nanosilica in a mat form have been studied. Hand layup procedures were used to create these composites, including varying weight % of nanosilica and variable fiber stacking sequencing. The different weight % are 3, 6, and 9, and the stacking sequences are B, C, and D. The effectiveness of ultrasonic irradiation on mechanical characteristics was investigated and related. The inclusion of 6 wt.% of SiO2 to the B type resulted in a 25% rise in tension and a 37% in bending. The addition of 6 wt.% silica to the C-type hybridization nanocomposite results in a 34% rise in tension and a 38% rise in bending. Extreme tension behavior is attained at 6 wt.% SiO2 with epoxy with the B type piling order, and extreme bending behavior is obtained at 6 wt.% SiO2 with the C type piling order. A B-type model composite with a 6-wt.% SiO2 addition performed better in hygroscopic than A, C, and D type model composites. An SEM is utilized to observe the microstructure of shattered materials.

Item Type: Article
Subjects: Scholar Eprints > Engineering
Depositing User: Managing Editor
Date Deposited: 27 Mar 2023 05:35
Last Modified: 02 Oct 2024 07:28
URI: http://repository.stmscientificarchives.com/id/eprint/1032

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